| 缩略图 | 器件名称 | 制造商 | 描述 | |
|---|---|---|---|---|
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A1020B-VQG80I | Microsemi SoC | IC FPGA 69 I/O 80VQFP |
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A102117 | Eaton Bussmann | CONN BARRIER STRIP 17CIRC .325 |
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A10233-30 | Laird Technologies - Thermal Materials | TPUTTY 502,FG2,040 9X9\" |
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A10233-31 | Laird Technologies - Thermal Materials | TPUTTY 502 FG2 040 18\" X 18\" |
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A10234-31 | Laird Technologies - Thermal Materials | TPUTTY 502 FG2 050 9\" X 9\" |
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A10234-38 | Laird Technologies - Thermal Materials | TPUTTY 502 FG2 050 18\" X 18\" |
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A10235-31 | Laird Technologies - Thermal Materials | TPUTTY 502,FG2,060 9X9\" |
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A10235-36 | Laird Technologies - Thermal Materials | TPUTTY 502 FG2 060 18\" X 18\" |
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A10236-04 | Laird Technologies - Thermal Materials | Tputty 502, FG2, 070 9x9\" |
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A10236-05 | Laird Technologies - Thermal Materials | TPUTTY 502 FG2 070 18\" X 18\" |
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A10237-21 | Laird Technologies - Thermal Materials | TPUTTY 502,FG2,080 9X9\" |
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A10237-22 | Laird Technologies - Thermal Materials | TPUTTY 502,FG2,080 18X18\" |
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A10238-08 | Laird Technologies - Thermal Materials | TPUTTY 502 FG2 090 18\" X 18\" |
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A10238-09 | Laird Technologies - Thermal Materials | TPUTTY 502 FG2 090 9\" X 9\" |
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A10239-09 | Laird Technologies - Thermal Materials | TPUTTY 502 FG2 100 9\" X 9\" |
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A10240-05 | Laird Technologies - Thermal Materials | TPUTTY 502 FG2 110 9\" X 9\" |
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A10241-09 | Laird Technologies - Thermal Materials | TPUTTY 502,FG2,120 9X9\" |
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A10242-04 | Laird Technologies - Thermal Materials | TPUTTY 502 FG2 130 9\" X 9\" |
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A10243-04 | Laird Technologies - Thermal Materials | TPUTTY 502 FG2 140 9\" X 9\" |
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A10244-06 | Laird Technologies - Thermal Materials | TPUTTY 502 FG2 150 9\" X 9\" |
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