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厂商 系列类型冷却封装接合方法形状长度宽度直径离基底高度(鳍片高度)不同温升时功率耗散不同强制气流时的热阻自然条件下热阻材料材料镀层
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QB0603B20WCATD QB0603B20WCATD American Technical Ceramics THERMAL CONDUCTOR
QB0603B20WCATD QB0603B20WCATD American Technical Ceramics THERMAL CONDUCTOR
QB0603B25WCATD QB0603B25WCATD American Technical Ceramics THERMAL CONDUCTOR
QB0603B25WCATD QB0603B25WCATD American Technical Ceramics THERMAL CONDUCTOR
QB0603B25WCATD QB0603B25WCATD American Technical Ceramics THERMAL CONDUCTOR
QB0805B25WCATD QB0805B25WCATD American Technical Ceramics THERMAL CONDUCTOR
QB0805B25WCATD QB0805B25WCATD American Technical Ceramics THERMAL CONDUCTOR
QB0805B25WCATD QB0805B25WCATD American Technical Ceramics THERMAL CONDUCTOR
QB0805B40WCATD QB0805B40WCATD American Technical Ceramics THERMAL CONDUCTOR
QB0805B40WCATD QB0805B40WCATD American Technical Ceramics THERMAL CONDUCTOR
QB0805B40WCATD QB0805B40WCATD American Technical Ceramics THERMAL CONDUCTOR
HS09 HS09 Apex Microtechnology HEATSINK TO3
HS01 HS01 Apex Microtechnology HEATSINK TOP MT TO-3
HS02 HS02 Apex Microtechnology HEATSINK 8P TO-3 4.5C/W
HS13 HS13 Apex Microtechnology HEATSINK TO3
HS18 HS18 Apex Microtechnology HEATSINK 12P PDIP
HS26 HS26 Apex Microtechnology HEATSINK OPEN FRAME 0.5C/W
HS24 HS24 Apex Microtechnology HEATSINK SMT
HS04 HS04 Apex Microtechnology HEATSINK 8P TO-3 .95C/W
HS27 HS27 Apex Microtechnology HEATSINK 12P PWR SIP
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