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厂商 系列类型冷却封装接合方法形状长度宽度直径离基底高度(鳍片高度)不同温升时功率耗散不同强制气流时的热阻自然条件下热阻材料材料镀层
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PDF 缩略图 器件名称 制造商 描述
HS09 HS09 Apex Microtechnology HEATSINK TO3
HS01 HS01 Apex Microtechnology HEATSINK TOP MT TO-3
HS02 HS02 Apex Microtechnology HEATSINK 8P TO-3 4.5C/W
HS13 HS13 Apex Microtechnology HEATSINK TO3
HS18 HS18 Apex Microtechnology HEATSINK 12P PDIP
HS26 HS26 Apex Microtechnology HEATSINK OPEN FRAME 0.5C/W
HS24 HS24 Apex Microtechnology HEATSINK SMT
HS04 HS04 Apex Microtechnology HEATSINK 8P TO-3 .95C/W
HS27 HS27 Apex Microtechnology HEATSINK 12P PWR SIP
HS03 HS03 Apex Microtechnology HEATSINK 8P TO-3 1.7C/W
HS33 HS33 Apex Microtechnology HEATSINK FOR DK AND HQ PACKAGES
HS06 HS06 Apex Microtechnology HEATSINK 12P PDIP .6C/W
HS23 HS23 Apex Microtechnology HEATSINK WAKEFIELD 232-200AB
HS21 HS21 Apex Microtechnology HEATSINK 6P DIP
HS28 HS28 Apex Microtechnology HEATSINK SIP
HS22 HS22 Apex Microtechnology HEATSINK THERMALLOY 6025B
HS32 HS32 Apex Microtechnology HEATSINK SIP 1.33C/W
HS14 HS14 Apex Microtechnology HEATSINK 8P TO-3 1.7C/W
HS29 HS29 Apex Microtechnology HEATSINK 12P TO220 2.7C/W
HS16 HS16 Apex Microtechnology HEATSINK 10P PDIP
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