缩略图 | 器件名称 | 制造商 | 描述 | |
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1542706-2 | TE Connectivity AMP Connectors | HEAT SINK XFP NETWORK APPS |
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628-40AB | Wakefield-Vette | HEATSINK CPU 43MM SQ BLK H=.4\" |
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658-45ABT3 | Wakefield-Vette | HEATSINK CPU 28MM SQ BLK W/TAPE |
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C247-025-1AE | Ohmite | HEATSINK FOR TO-247 WITH 1 CLIP |
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C60-075-VE | Ohmite | HEATSINK FOR TO-247 TO-264 |
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547-24AB | Wakefield-Vette | HEATSINK DC/DC QUARTER BRICK |
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206-1PABHE | Wakefield-Vette | HEATSINK VERT ALUM BLK TO-220 |
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634-20ABPE | Wakefield-Vette | HEATSINK TO-220 VERT MT BLK 2\" |
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253-122ABE-22 | Wakefield-Vette | HEATSINK LOW PROFILE |
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LGA-HTSK-KIT-050 | Artesyn Embedded Technologies | LGA ACC KIT |
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Y92B-A150N | Omron Automation and Safety | HEAT SINK FOR 25A G3NA SERIES |
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904-27-2-12-2-B-0 | Wakefield-Vette | HEATSINK 27X27X12MM PIN |