| 缩略图 | 器件名称 | 制造商 | 描述 | |
|---|---|---|---|---|
|
|
558-75AB | Wakefield-Vette | HEATSINK DC/DC FULL BRICK |
|
|
|
APA501-80-003 | Artesyn Embedded Technologies | HEATSINK (80) 115X59X22.5MM VERT |
|
|
|
APA501-60-003 | Artesyn Embedded Technologies | HEATSINK (60)57.5X59X22.5MM VERT |
|
|
|
APF19-19-13CB/A01 | CTS Thermal Management Products | HEATSINK FORGED W/ADHESIVE TAPE |
|
|
|
577002B00000G | Aavid Thermalloy | HEAT SINK TO-220 .250\" COMPACT |
|
|
|
517-95AB | Wakefield-Vette | HEATSINK BXB50,75,100,150.95\"HRZ |
|
|
|
BDN14-3CB/A01 | CTS Thermal Management Products | HEATSINK CPU W/ADHESIVE 1.41\"SQ |
|
|
|
APF19-19-10CB/A01 | CTS Thermal Management Products | HEATSINK FORGED W/ADHESIVE TAPE |
|
|
|
501706B00000G | Aavid Thermalloy | BOARD LEVEL HEAT SINK |
|
|
|
392-300AB | Wakefield-Vette | HI-POWER HEATSINK SSR/IGBT/POWER |
|
|
|
DV-T263-101E-TR | Ohmite | TO-263 HEAT SINK / POLY TAPE |
|
|
|
QB0603B20WCATD | American Technical Ceramics | THERMAL CONDUCTOR |
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