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厂商 包装系列类型应用安装类型封装/外壳供应商器件封装
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PDF 缩略图 器件名称 制造商 描述
NT25L51-WP NT25L51-WP Semtech Corporation IC AMP TIA AGC OC48/GPONG DIE
NT24L73-MSOP NT24L73-MSOP Semtech Corporation IC AMP LIMITING 1.25GBPS 10MSOP
NT24L71-QSOP NT24L71-QSOP Semtech Corporation IC AMP LIMITING 1.25GBPS 16QSOP
GN25L52-PR GN25L52-PR Semtech Corporation IC AMP TIA 2.5GB DIE WAFER
GN25L53-PR GN25L53-PR Semtech Corporation IC AMP TIA 2.5GB DIE WAFER
GN25L52-GRP6 GN25L52-GRP6 Semtech Corporation IC AMP TIA 2.5GB OC-48 DIE RING
GN25L52-GRP8 GN25L52-GRP8 Semtech Corporation IC AMP TIA 2.5GB OC-48 DIE RING
GN25L53-GRP6 GN25L53-GRP6 Semtech Corporation IC AMP TIA 2.5GB OC-48 DIE RING
GN25L53-GRP8 GN25L53-GRP8 Semtech Corporation IC AMP TIA 2.5GB OC-48 DIE RING
NT32012-GRP6 NT32012-GRP6 Semtech Corporation IC AMP TIA BARE DIE
NT32012-GRP8 NT32012-GRP8 Semtech Corporation IC AMP TIA BARE DIE
NT22010-DTF8S NT22010-DTF8S Semtech Corporation IC POF RECEIVER LVDS TIA+LA DIE
NT22010-GRP6 NT22010-GRP6 Semtech Corporation IC POF RECEIVER LVDS TIA+LA DIE
NT22012-GRP6 NT22012-GRP6 Semtech Corporation IC POF RECEIVER LVPECL TIA+LA
GN25L52-WP GN25L52-WP Semtech Corporation IC AMP TIA 2.5GB 8\" DIE WAFER
GN25L53-WP GN25L53-WP Semtech Corporation IC AMP TIA 2.5GB 8\" DIE WAFER
NT22010-WP NT22010-WP Semtech Corporation IC POF RECEIVER LVDS TIA+LA DIE
NT22012-WP NT22012-WP Semtech Corporation IC POF RECEIVER LVPECL TIA+LA
NT25L55-PR NT25L55-PR Semtech Corporation IC AMP TIA BARE DIE
NT25L59-DTF8S NT25L59-DTF8S Semtech Corporation IC AMP TIA 2.5G AGC GPON PD DIE
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