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厂商 包装系列类型应用安装类型封装/外壳供应商器件封装
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PDF 缩略图 器件名称 制造商 描述
NT25L59-GRP6 NT25L59-GRP6 Semtech Corporation IC AMP TIA 2.5G AGC GPON PD DIE
NT25L59-GRP8 NT25L59-GRP8 Semtech Corporation IC AMP TIA 2.5G AGC GPON PD DIE
NT25L59-PR NT25L59-PR Semtech Corporation IC AMP TIA 2.5G AGC GPON PD DIE
NT25L55-DTF8SR NT25L55-DTF8SR Semtech Corporation IC AMP TIA BARE DIE
NT25L59-WP NT25L59-WP Semtech Corporation IC AMP TIA 2.5G AGC GPON PD DIE
NT32012-WP NT32012-WP Semtech Corporation IC AMP TIA BARE DIE
NT28L52-PR NT28L52-PR Semtech Corporation IC AMP TIA LIMITING 10BASE-SR
NT28L52-DTF8SR NT28L52-DTF8SR Semtech Corporation IC AMP TIA LIMITING 10BASE-SR
NT28L52-WP NT28L52-WP Semtech Corporation IC AMP TIA LIMITING 10BASE-SR
GN1250L-CNTE3 GN1250L-CNTE3 Semtech Corporation IC AMP LIMITING 10/11.3G 16QFN
GN1250L-CNE3 GN1250L-CNE3 Semtech Corporation IC AMP LIMITING 10/11.3G 16QFN
GN1068-GRP6 GN1068-GRP6 Semtech Corporation IC AMP TIA LIMIT 16G FC GRIP RNG
GN1068-CHIP GN1068-CHIP Semtech Corporation IC AMP TIA LIMITING FOR 16G FC
GN7068-CHIP GN7068-CHIP Semtech Corporation IC AMP TIA 10G LIMITING DIE
GN1032W-CHIP GN1032W-CHIP Semtech Corporation IC AMP TIA 2.5GBPS SONET CHIP
GN1035CWA-CHIP GN1035CWA-CHIP Semtech Corporation IC AMP TIA 2.5GBPS SONET CHIP
GN7053-CHIP GN7053-CHIP Semtech Corporation IC AMP TIA 1.25G GPON DIE
GN1058CW-CHIP GN1058CW-CHIP Semtech Corporation IC AMP TIA 10G LIN AGC REV PIN
GN1052WA2-CHIP GN1052WA2-CHIP Semtech Corporation 10/11.3 GB/S LIMITING TRANSIMPED
GN1052CW-CHIP GN1052CW-CHIP Semtech Corporation IC AMP TIA 10/11.3GBPS BICMOS
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