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厂商 系列使用形状外形厚度材料粘合剂底布,载体颜色热阻率导热率
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PDF 缩略图 器件名称 制造商 描述
CPU 1.75X1.75 CPU 1.75X1.75 Bergquist THERMAL PAD CPU 1.75\" X 1.75\"
CPU 1.375X1.375 CPU 1.375X1.375 Bergquist THERM PAD CPU 1.375\" X 1.375\"
BP100-0.005-00-1010 BP100-0.005-00-1010 Bergquist THERMAL TAPE DOUBLE SIDED .005\"
K10 12\ K10 12\" X 12\" Bergquist THERMAL PAD 12\"X12\" .006\" K10
CPU .005\ CPU .005\" 12\" X 12\" Bergquist THERMAL PAD 12\"X12\"
SP1500ST-0.008-00-1012 SP1500ST-0.008-00-1012 Bergquist THERMAL PAD 1500 10\"X12\"
BOND PLY 660P 11X12\ BOND PLY 660P 11X12\" Bergquist THERMAL TAPE DOUBLE SIDED .008\"
SPK10-0.006-AC-1212 SPK10-0.006-AC-1212 Bergquist THERMAL PAD 12\"X 12\" .006\" K10
SPK4-0.006-00-1212 SPK4-0.006-00-1212 Bergquist THERMAL PAD 12X12\" .006\" K4
BG411328.01 BG411328.01 Bergquist EAGLE TEST SYST HAR2605G REV3
HSP-2 HSP-2 Crydom Co. THERMAL PAD SNGL PHASE WADHESVE
HSP-1 HSP-1 Crydom Co. THERMAL PAD SINGLE PHASE
HSP-3 HSP-3 Crydom Co. THERMAL PAD TRIPLE PHASE
HSP-5 HSP-5 Crydom Co. THERMAL PAD 3-PHASE W/ADHESIVE
HSP-6 HSP-6 Crydom Co. THRML PAD FOR EL SERIES SSR NON-
TP01 TP01 Crydom Co. THERMAL PAD SINGLE PHASE
TP03 TP03 Crydom Co. THERMAL PAD TRIPLE PHASE
TP01-M TP01-M Crydom Co. THERMAL PAD SINGLE PHASE
TO-218-70 TO-218-70 Essentra Components TRANSISTOR INSUL PAD 1.41X.81\"
TO-220-68 TO-220-68 Essentra Components TRANSISTOR INSUL PAD 1.13X.63\"
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